AI 반도체 생태계의 재편: 메모리 중심의 글로벌 공급망 전략

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1. [1]

   Samsung, SK Hynix Advance HBM, HBF for AI Era

   1차 출처

   조선일보 · 2026-08-07

   Samsung, SK Hynix Advance HBM, HBF for AI Era

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2. [2]

   Samsung and SK Unveil Next-Gen Semiconductors to Overcome 'Memory Wall'

   1차 출처

   news.sbs.co.kr · 2026-08-07

   Main image - SBS News ▲ Kim Kyoung-ryun, Vice President at Samsung Electronics, introduces 'zHBM'. The main focus at "FMS 2026," a memory semiconductor event that opened on the 4th (local time) at the Santa Clara Convention Center in California, USA, was on how to overcome the "Memory Wall," which has emerged as a new limitation in the artificial intelligence (AI) era. This is because as AI evolves beyond simply answering human questions into an "AI agent" stage where it plans and executes tasks on its own, the importance of memory in storing and transmitting data is growing increasingly crucial. No matter how exceptional the performance of an AI semiconductor is, its computing power cannot be fully utilized if the necessary data is not supplied in a timely manner. It is similar to how even the smartest brain has difficulty functioning properly if the data it needs to process arrives late. As a solution to cross this memory wall, Samsung Electronics presented a three-dimensional technology that breaks away from the conventional planar structure by stacking memory vertically. Currently, High Bandwidth Memory, or HBM, is placed alongside AI accelerators such as Graphics Processing Units (GPUs) to exchange data.

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3. [3]

   Samsung, SK Hynix Unveil AI Memory Innovations at FMS 2026

   1차 출처

   조선일보 · 2026-08-07

   Samsung, SK Hynix Unveil AI Memory Innovations at FMS 2026

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4. [4]

   Samsung Elec, SK Group seal $950 billion deals as South Korea hosts AI powers

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   WTVB · Fri, 24 Jul 2026 07:00:00 GMT

   By Max A. Cherney and Heekyong Yang SAN FRANCISCO/SEOUL, July 24 (Reuters) – South Korea announced $950 billion in new AI initiatives involving Samsung Electronics, SK Group and U.S. tech firms as global AI leaders rush to fill a shortage of faster chips to power and develop more advanced systems. SK Group has signed deals worth $750 billion, including SK Hynix’s partnership with Nvidia valued at more than $500 billion, South Korea’s presidential ​Blue House said after an AI summit hosted by President Lee Jae Myung in San Francisco. Samsung Electronics said it had signed a memorandum ‌of understanding with Broadcom covering up to $200 billion across memory chips, foundry services and advanced packaging. The deals are the latest moves by U.S. AI firms hoping to lock in supply as demand for chips and computing infrastructure outpaces supply, driving tech companies into closer partnerships with South Korea’s semiconductor and memory leaders. Speaking at the summit, Lee said South Korea would lead the way to a new era of AI in partnership with global technology companies, making available its “dynamic AI ecosystem” to expand the global market for industrial and personal AI use. He unveiled a “San ‌Francisco ​AI Declaration” that outlined South Korea’s AI ambitions for technological cooperation with the United States.

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5. [5]

   Samsung Reveals New 3D-Memory Roadmap In Bid For AI Tech Lead

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   NDTV Profit · Wed, 05 Aug 2026 02:27:49 GMT

   Samsung Reveals New 3D-Memory Roadmap In Bid For AI Tech Lead Samsung Electronics unveiled advanced memory hardware with eight times the performance of next-gen HBM5, aiming to lead the AI memory market. Advertisement Read Time: 2 mins Samsung's technological push comes as fierce competition rages in the near-$1 trillion memory market. Photo: Unsplash Samsung Electronics Co. offered a glimpse of its most advanced memory hardware, touting improved performance and power efficiency in a bid to overtake rivals SK Hynix Inc. and Micron Technology Inc. in the race for long-term dominance. The new system vertically stacks high-bandwidth memory on top of AI accelerators, delivering about eight times the performance of next-generation HBM5, Samsung said in a statement. Using advanced wafer-bonding technology, the system will also achieve more than 10 times the memory density of HBM5, while also allowing customized designs. Samsung intends to ramp up production of HBM4 in the second half of this year. It hasn't yet offered a definitive timeline for HBM5 or this future technology. Advertisement Samsung's technological push comes as fierce competition rages in the near-$1 trillion memory market where Samsung is trading blows with SK Hynix, which established an early stronghold in the AI memory boom, as well as US-based Micron.

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6. [6]

   [News] SK hynix Reportedly Hires for 3D-Stacked DRAM-on-Logic With a U.S. Customer; Targets On-Device AI

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   TrendForce · Fri, 24 Jul 2026 07:05:30 GMT

   [News] SK hynix Reportedly Hires for 3D-Stacked DRAM-on-Logic With a U.S. Customer; Targets On-Device AI 2026-07-24 Semiconductors editor SK hynix is reportedly stepping up development of 3D-stacked DRAM, a next-generation memory technology for on-device AI. According to ZDNet , the company has reportedly begun recruiting 3D-Stacked DRAM-on-Logic Design Engineers through its U.S. subsidiary in San Jose, California. SK hynix is also said to have partnered with a specific customer to develop applications for the technology. This marks the first time SK hynix has recruited specialists dedicated to 3D-stacked DRAM. As the technology gains attention as a next-generation memory solution for on-device AI, the move is seen as an early effort to prepare for commercialization. 3D-Stacked DRAM-on-Logic: A Next-Generation Memory Architecture In the job posting, SK hynix said it is seeking engineers to work closely with a U.S. customer to co-design logic dies for 3D-Stacked DRAM-on-Logic, an advanced packaging architecture that vertically integrates DRAM directly on top of a system-on-chip. Unlike package-on-package (PoP), which stacks separately packaged chips, 3D-Stacked DRAM-on-Logic enables much shorter interconnects and more data I/O channels within the same footprint.

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